Molded Interconnect Device 「SKW-MID」

Three-Dimensional Molded Interconnect Devices (3D-MID)

An Integrated Design System for Molded Interconnect Devices (3d-mid)

In this paper, MIDCAD, an integrated design system for Molded Interconnect Devices, is presented and some important techniques for the development of this design system are discussed. A series of MID-related special functions and an integrated MID product model, which are not supported by conventional MCAD und ECAD systems, were developed in MIDCAD. Based on the product model, the simulation of...

Flexible free-standing SU-8 microfluidic impedance spectroscopy sensor for 3-D molded interconnect devices application

The current contribution reports about the fabrication technology for the development of novel microfluidic impedance spectroscopy sensors that are directly attachable on 3-D molded interconnect devices (3DMID) that provides an opportunity to create reduced-scale sensor devices for 3-D applications. Advantages of the MID technology in particular for an automotive industry application were recen...

Chapter 6 : Models of Process Variations in Device and Interconnect

Variation is the deviation from intended or designed values for a structure or circuit parameter of concern. The electrical performance of microprocessors or other integrated circuits are impacted by two sources of variation. Environmental factors are those which arise during the operation of a circuit, and include variations in power supply, switching activity, and temperature of the chip or a...

Connection Oriented Routing Environment (CORE): A Generalized Device Interconnect

Inter-communicating devices are changing the way that services and connections are set up and established over a network. This paper introduces a new paradigm for setting up a peer connection between agents through a third party administrative agent called the connection oriented routing environment (CORE). In this new paradigm, the devices no longer follow the client/server model of communicat...